二手松下贴片机MSR程���的构成

分享到:
点击量: 140599 来源: 深圳市和佳泰科技有限公司
二手松下贴片机MSR程序的构成
程序的构成:
1.            PCBOGR----SUPPORT PIN REMOVAL---PCB PROGRAM CREATION---自动调宽---REFERENCE PIN 调整(OPTION---STOPPER ADJUSTMENT—SUPPORT PININSTALLATION—PCB TRANSFER
2.            MARK LIBRARY
3.            NC PROGRAM
4.            PARTS LIBRARY
5.            ARRAY PROGRAM
6.            PROGRAM SELECTION
一.       PCB PROGRAM的理解
二.       MARK LIBRARY的理解
1.PCB MATERIAL CODE
CODE
PCB MATERIAL
MARK MATERIAL
 
0
PAPER PHENOL
(基板是树脂)
 COPPER FOIL
铜箔
 
1
PAPER PHENOL
(基板是树脂)
SOLDER METAL PLATING(锡箔)
 
4
CERAMIC
(基板是陶瓷)
SILVER PALLADIUM PASTE(银箔)
 
5
CERAMIC
(基板是陶瓷)
铜箔
 
6
CERAMIC
(基板是陶瓷)
GOLD PADTE(金箔)
 
2REC TYPE
 
 
 
0
GRAY SCAL MARK(辉度)
 
1
BINARY MARK(二值)用在氧化板上
 
2
DISTINCTION MARK(特殊MARK,一般不用,BAD MARK识别,用于拼版,其中一块损伤情形)
 
2—DISTINCTION MARK
   DISTINCTION MARK必须比框大,一般2MM*2MM以上
   正负10百分—NORMAL20百分—ROUGH30百分—VERY ROUGH
2.LIGHT
 
 
MSR
MV2VB
1
SPREAD环射
RING
2
DIRECT弱射
SPOT
3
DIRECT+SPREAD环+弱
RING+SPOT

LED

 
SPREAD
DIRECT

                            

 

 
 
 
 
(三)、NC PROGRAM 的理解
*确定元件安装顺序时,应注意以下几点
1.按元件尺寸由小到大地贴装。
2.为使Z轴移动较少,同一元件的尺寸应集中贴装。
3.尽量使X-Y TABLE少移动。
*程序指令优先顺序:
1.执行(SR)语句
2.BAD MARK语句坏板标记检出指令
3.MARK 语句
4.贴装语句
 
 
 
N C:     ARRAY:    PCB:     
OFFSET X:     Y:      HM:     MULTI ORG.    BLOCKS:     MARK LAND:
BLOCK
NO.
X
Y
Z NO.
S&R
THETA
θ
SKIP
MT.HGHT
MRK
NO
MT.WAIT
GROUP
PROD
CMNT
1
0
0
1
02
0
0
0
0
0
0
 
0
 
2
-124.2
37.5
1
22
0
0
0
0
0
0
 
0
 
3
 
 
 
 
 
 
 
 
 
 
 
 
 
4
 
 
 
 
 
 
 
 
 
 
 
 
 
 
1.NCARRAYPCB
2.OFFSETX     Y
INPUT THE DIFFERENCEDISTANCEBETWEEN THE ORIGINAL POSITION OF THE PANASERT AND POSITIONS OF THE X AND Y COORDINATES ON THE PC BOARD
指线路板上的坐标原点与机器固有的机械原点之间的距离补偿。
机械原点是固定值,坐标原点因每个程序而异,可自由设定。
设置坐标原点后,设置程序补偿值。
 
*机器的原点到程序原点(机器贴装头)的距离。

MACHINE OFFSET值应放在MACHINE DATA内,但往往MACHINE DATA内并未设置。

XY

 
YY

程序补偿值因单台设备而多少有些差异,设置补偿值后,实际贴装一个元件,直到修正无误为止。

 

一般设置程序补偿值以**个贴装点为准或MARK点为准。
*背离电机:负
   接近电机:正
*CAD数据+MACHINE OFFSET=生产坐标
3.HMX-Y T):贴装时等待高度。(前道工序已安装元件的*高高度,设置该值,防止碰到
已安装元件。
4.MULTI ORG:多重原点
MLTI ORG F=
默认值是1
     例:MULTI-ORIGIN=40                                                                                       

                                            NO.1    NO.2
1
2
..
 
 
 
 
39
40
41
42
...
 
 
75
因可根据不同程序指定,所以若将数种元件配置事先装好后只需变更多重原点的指定,便可更换生产的品种。
5.BLOCKS
6.MARK LAND:共有多少MARK56机器会显示,不可修改)
7.BLOCK:编号
8.XY:贴装点的坐标
X:右为正,左为负;
Y:里侧为正,外侧为负。
 
9.Z NO。:用哪一料站
 
 
标准送料器(SINGLE)
DOUBLE
K
21.5MM
10.75MM
Q
20.00MM
10.00MM
 
10.S&R:用两列代码指定连片逐点或连片逐片方式及贴装图案的旋转角度。
 
0
1(STEP REPEAT)
2(PATTERN REPEAT)
0(0度)
NORMAL MOUNTING
NO ROTATION
 
 
1(90度)
 
STEP REPEAT
90度ROTATION
PATTERN REPEAT
90度ROTATION
2(180度)
 
STEP REPEAT
180度ROTATION
PATTERN REPEAT
180度ROTATION
3(270度)
 
STEP REPEAT
270度ROTATION
PATTERN REPEAT
270度ROTATION
 
      01O度STEP REPEAT
      1190度STEP REPEAT
      21180度STEP REPEAT
      31270度STEP REPEAT
      020度PATTERN REPEAT
      1290度PATTERN REPEAT
           22180度PATTERN REPEAT
           32270度PATTERN REPEAT
注:S&R的**个图案的补偿值(X、Y坐标)必须输入(0,0)
     若语句1S&R写22,贴装出错.
11SKIP:    1)0:BLOCK IS EXECUTED
                   2)7:BLOCK IS NOT EXECUTED(无条件跳跃)
                   3)1-6,8,9有条件跳跃

270

 

                注:如果**句被SKIP掉,机器会执行PASS-THROUGH

 

12.THETA:贴装角度:元件在PCB板上贴时的角度。

 

180

 

 13MT.HGH

 

 
T:贴装高度补偿(X-Y T补偿)
14.MRK:
MARK
FIDUCIAL
0:NO MARK
1:INDIVIDUAL MARK
2:BOARD MARK
3:PATTERN MARK(拼版)
4:GROUP MARK
DISTINCT MARK
DISTINCT MARK(SENSOR)
10:BAD MARK
13:VARIETY SELECT MARK
DISTINCT MARK(CAMERA)
20:BAD MARK
23:VARIETY SELECT MARK
 
15.NO:禁止贴装判断 0:进行贴装 1:禁止贴装
16.MT.WAIT:贴装等待0:正常贴装
                    1:贴装等待(一般是较高的元件,防止碰撞而放在*后贴装)
17.GROUP(单独使用):
18.PROD:(异种针对混合类型,二者配合使用)
19.CMNT:注释
 
 
EXAMPLE:普通阴阳板
BLOCK
NO.
X
Y
Z NO.
S&R
THETA
θ
SKIP
MT.HGHT
MRK
NO
MT.WAIT
GROUP
PROD
CMNT
1
0
0
1
02
0
0
0
0
0
0
0
0
 
2
88.4
0
1
02
0
0
0
0
0
0
0
0
 
3
0
0
1
0
0
0
0
23
0
0
0
1
 
4
0
0
1
0
0
0
0
23
0
0
0
2
 
5
0
0
1
0
0
0
0
4
0
0
1
0
 
6
0
0
1
0
0
0
0
4
0
0
2
0
 
7
43.35
77.36
1
0
0
0
0
0
0
0
1
1
R1
8
48.38
74.77
2
0
90
0
0
0
0
0
1
1
C1
9
96.5
69.80
3
0
0
0
0
0
0
0
2
2
Q1
10
99.21
69.80
4
0
270
0
0
0
0
0
2
2
Q2
METHORD
CLASSIFICATIONG
TYPE
APPLICABLE  PART
TRANSMISSIVE(BINARY)透射
1
0
Square chip(standard)
2
0
Small transistor(standard)
2
1
Small transistor(part with marry burrs on the body)
3
0
Thin component(standard)
3
1
Thin component(part that looks as if it has a hole)
4
0
QFP,SOP(standard)
6
0
Large transisitor(standard)
7
0
Odd-shaped component(standard)
8
0
HEMT(standard)
9
0
Round component(standard)
11
0
Aluminum electrolytic capacitor(standard)
Reflective (Gray scale)   反射
13
0
Air wound coil
20
0
Square chip resistor(strong against noise)
20
1
Square chip resistor
20
3
Square chip resistor(with upside down check)
21
0
Cylindrical chip resistor(standard)
21
1
Cylindrical chip resistor(when reflection is unstable)
22
0
Chip resistor network(with pickup check)
22
1
Chip resistor network(without pickup check)
30
0
Square chip capacitor(when nozzle glitters)
30
1
Square chip capacitor(standard)
31
0
Tantalum electrolytic capacitor(black)
31
1
Tantalum electrolytic capacitor(white)
32
0
Tantalum electrolytic capacitor(black)
40
0
Transistor(standard)
40
1
Transistor(with wide lead)
40
5
Transistor(with electrode which appears to be dark)
41
0
Mini power transistor(standard)
42
0
Large power transistor(standard)
43
0
Two-terminal diode(standard)
44
0
Light emitting diode
44
1
Light emitting diode(standing pickup check at both edge electrodes)
44
2
Light emitting diode(standing pickup check at the body center)
48
0
SOP
50
0
Unidirectional lead connector
51
0
2-directional lead connector
Reflective (Gray scale)   反射
52
0
SOP
53
0
QFP
54
0
SOJ
55
0
PLCC
56
0
Black BGA/CSP
57
0
LCC
72
0
Chip SAW filter(inclination determined by four sides)
72
1
Chip SAW filter(inclination determined by top/bottom sides)
72
2
Chip SAW filter(inclination determined by left/right sides)
86
0
Checker chip
90
0
White connector
90
3
Shield case