印制电路词汇知识

印制电路词汇知识——基本词汇

平时，smt工程师们用的PCB画板工具都是外国工程师研究出来的，里面几乎都是英文单词，虽然有些工具软件被翻译成中文，但掌握这些常用的印制电路词汇还是大有好处的。

下面来大概介绍下，
1、基材：base material
2、层压板：laminate
3、覆金属箔基材：metal-clad bade material
4、覆铜箔层压板：copper-clad laminate (CCL)
5、单面覆铜箔层压板：single-sided copper-clad laminate
6、双面覆铜箔层压板：double-sided copper-clad laminate
7、复合层压板：composite laminate
8、薄层压板：thin laminate
9、金属芯覆铜箔层压板：metal core copper-clad laminate
10、金属基覆铜层压板：metal base copper-clad laminate
11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film
12、基体材料：basis material
13、预浸材料：prepreg
14、粘结片：bonding sheet
15、预浸粘结片：preimpregnated bonding sheer
16、环氧玻璃基板：epoxy glass substrate
17、加成法用层压板：laminate for additive process
18、预制内层覆箔板：mass lamination panel
19、内层芯板：core material
20、去铜箔面：foil removal surface
21、层压板面：unclad laminate surface
22、基膜面：base film surface
23、胶粘剂面：adhesive faec
24、原始光洁面：plate finish
25、粗面：matt finish
26、纵向：length wise direction
27、模向：cross wise direction
28、剪切板：cut to size panel
29、催化板材：catalyzed board ,coated catalyzed laminate
30、涂胶催化层压板：adhesive-coated catalyzed laminate
31、涂胶无催层压板：adhesive-coated uncatalyzed laminate
32、粘结层：bonding layer
33、粘结膜：film adhesive
34、涂胶粘剂绝缘薄膜：adhesive coated dielectric film
35、无支撑胶粘剂膜：unsupported adhesive film
36、覆盖层：cover layer (cover lay)
37、增强板材：stiffener material
38、铜箔面：copper-clad surface
39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-cladlaminates(phenolic/paper CCL)
40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates(epoxy/paper CCL)
41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates
42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfacescopper-clad laminates
43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforcedcopper-clad laminates
44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates
45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-cladlaminates
46、双���来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glassfabric copper-clad lamimates
47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-cladlaminates
48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates
49、超薄型层压板：ultra thin laminate
50、陶瓷基覆铜箔板：ceramics base copper-clad laminates
51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates

印制电路词汇知识——基本词汇 介绍完毕。