①Board To Board Connector板对板连接器②Wire To Board Connector线对板连接器③I/O ConnectorI/O连接器④Solar Connector焊线式连接器⑤Terminal Blocks接线端子⑥Cable Assembly线缆.Pin Header Connector排针连接器Female Header Connector Din 41612 Connector欧式连接器PC 104 ConnectorPC104连接器Machine Pin Connector车PIN连接器Box Header Connector简牛连接器Ejector Header Connector牛角连接器Wafer/Housing/Terminal白色连接器（针座/外壳/端子）Mirco Match ConnectorPicoflex ConnectorIDC Socket ConnectorDIP PlugConnector FPC/FFC ConnectorSATA ConnectorD-SUB ConnectorSCSI ConnectorHDMI ConnectorDVI ConnectorUSB ConnectorPhone JACKRCA JACKSolar Junction BoxTerminal Block ConnectorFlat CableWire Harness CableBattery ConnectorIC Socket ConnectorLED ConnectorMini JumperPLCC ConnectorMedical ConnectorPower Distribution ConnectorEdge ConnectorAntennaRJ45JACK RFConnector
1. SCOPE 規範
1.1. Contents 內容
This specification covers the performance,tests and quality requirements for the XXX, R/A, V/T, xx ㎜ Pitch Connector.
規格書包含xxx,R/A,V/T,xxpitch連接器的成果、測試及品質需求
1.2. Qualification限定
When tests are performed on the subjectproduct line, the procedures specified in Tyco 109 series specifications shallbe used. All inspections shall be performed using the applicable inspectionplan and product drawing.
當在生產線上執行測試，需使用Tyco 109系列規格書之具體指定程序。所以有檢驗必須有適當的執行計畫及產品圖面。
2. Applicable Document所需文件
Thefollowing Tyco documents form a part of this specification to the extentspecified herein. Unless otherwise specified, the latest edition of thedocument applies. In the event of conflict between the requirements of thisspecification and the product drawing, the product drawing shall takeprecedence. In the event of conflict between the requirements of thisspecification and the referenced documents, this specification shall takeprecedence.
下列的Tyco文件格式為在此文中指定的範圍，除了別的指定之外，*新版的文件需求。如果在產品規格書及產品需求上有抵觸，應以產品圖面為主。如在規格需求及需求文件上有所抵觸，應以規格書為主。
2.1. TYCO SPECIFICATIONS Tyco規格書
A. 109-1: General Requirements for Test Specifications 測試規格之普遍規定
B. 109-197：Tyco Specification vs EIA andIEC Test Methods Tyco規格vs EIA和IEC測試方式
C. 501-XXX：Test Report 測試報告
3. Requirements 規定
3.1. DESIGN AND CONSTRUCTION 目的及意義
Product shall be of the design,construction and physical dimensions specified on the applicable productdrawing.
產品適當的產品圖面設計及物理規格。
3.2. MATERIALS原料
A. Housing本體：Thermoplastic, UL94V-0熱塑膠,UL94V-0
B. Contact接觸：Copper Alloy, Gold plating oncontact area, Tin Plating on soldertail over Nickel underplating overall.
合成銅，在接觸地鍍金，在電鍍鎳上鍍錫
C. Shield焊料：Copper Alloy, Gold plating on contact area, Tin Platingon soldertail over Nickel underplating overall.
合成銅，在接觸地鍍金，在電鍍鎳上鍍錫
3.3. RATINGS等級
A. Voltage電壓: XX VAC rms.
B. Current電流: XX A Max
C. Temperature溫度: - X ℃ to X ℃
3.4. Performance REQUEIREMENT and Test description
成果需求及測試描述
The product shall be designed to meet theelectrical, mechanical and environmental performance requirements specified inFigure 1. All tests shall be performed at ambient environmental conditions perAMP Specification 109-1TEST REQUIREMENTS AND PROCEDURES SUMMARY.
產品需設計在需求規範一的電力、物理及環境性能需求上。所有的執行的測試需符合AMP 109-1測試需求及簡易程序
3.5. Test Requirements and Procedures Summary
測試需求及簡易程序
Test Item測試項目 Requirement需求
Procedure程序
Examination of Product產品檢驗
Meets requirements of product drawing. No physical damage.
需符合產品圖面並沒有物質損害
Electrical Requirement用電需求
[ ] m Ohm Max(Initial)*初
[ ] m Ohm Max(Final)*終
Subject mated contacts assembled in housing to 20mV Max open circuit at 10mA Max. EIA-364-6B. Refer to Fig.3
Dielectric withstanding Voltage
耐電壓
No creeping discharge or flashover shall occur. 沒有緩慢的釋放或發生閃結
Current leakage: 0.5 mA MAX
漏電流
[ ]VAC for 1minute
Test between adjacent circuits of unmated connector. EIA-364-20B
Insulation Resistance [ ] M Ohm Min.(Initial) [ ] M Ohm Min.(Final)
Impressed voltage 500 VDC.
Test between adjacent circuits of unmated connector. EIA-364-21C.
Temperature Rising 30℃ Max. Under loaded rating current在電流等級之下
Contact series-wired, apply test current of loaded rating current to the circuit, and measure the temperature rising by probing on soldered areas of contacts, after the temperature becomes stabilized deduct ambient temperature from the measured value.
Mechanical Requirement
Connector Mating Force連接器的插入力
Operation Speed：[ ] mm/min.
Measure the force required to mate connector. EIA-364-13B
Connector Unmating Force連接器的拔出力
kgf Min. or
kgf/Pin Min..
Operation Speed：[ ] mm/min.
Measure the force required to unmate connector. EIA-364-13B
Operation Speed：[ ] cycle/min.
Durability Cycles：10,000 Cycles
EIA-364-9C
No electrical discontinuities
greater than 0.1 or 1μsec shall occur.
See Note.
Subject mated connectors to 10-55-10
Hz traversed in 1minutes at 1.52
mm amplitude 2
Hours each of 3 mutually perpendicular planes. 100mA Max. Applied. EIA-364-28D, ConditionⅠ
No electrical discontinuity greater than 0.1 or 1μsec shall occur.
See Note.
Accelerate Velocity：490m/s2 （50G） Waveform：Half-sine shock plus Duration：11msec
No. of Drops：3 drops each to normal and reversed directions of X,Y and Z axes, totally 18 drops, passing DC 100mA max. current during the test. EIA-364-27B, Method A
The inspected area of each lead must have 95% solder coverage minimum.
Steam Aging Preconditioning：
1. Intended for nontin and nontin-alloy leadfinishes for 93+3/-5℃、1hrs.
2. Intended for tin and tin-alloy leadfinishes for 93+3/-5℃、8hrs.
<JESD22-B102D, Condition C>
Solder pot temperature: 245±5℃, 5sec
Environmental Requirements
Resistance to Wave Soldering Heat
波焊的阻抗
No physical damage shall occur.
沒有發生物質損害
Solder Temp.：240±5℃, 10±0.5sec.
Tyco spec. 109-202, Condition A
Resistance to Wave Soldering Heat
波焊的阻抗
No physical damage shall occur.（Lead-Free）
沒有發生物質損害
Solder Temp.：265±5℃, 10±0.5sec.
Tyco spec. 109-202, Condition B
Resistance to Reflow Soldering Heat回流的阻抗
No physical damage shall occur.
沒有發生物質損害
Pre Heat：100~150℃, 60 sec Max.
Heat：210℃ Min., 30 sec Max.
Peak Temp.：240℃ Max., 10±0.5sec.
Resistance to Reflow Soldering Heat回流的阻抗
No physical damage shall occur.（Lead-Free）
沒有發生物質損害
Pre-soak condition, 85℃/85﹪RH for 168 hours.
Pre Heat：150~180℃, 90±30sec.
Heat：230℃ Min., 30±10sec.
Peak Temp.：245+0/-5℃, 10~30sec.
Duration：3 cycles
Tyco spec. 109-201, Condition A
Resistance to Reflow Soldering Heat波焊的阻抗
No physical damage shall occur.（Lead-Free）
沒有發生物質損害
Pre-soak condition, 85℃/85﹪RH for 168 hours.
Pre Heat：150~180℃, 90±30sec.
Heat：230℃ Min., 30±10sec.
Peak Temp.：260+0/-5℃, 20~40sec.
Duration：3 cycles
Tyco spec. 109-201, Condition B
Mated Connector -55+/-3℃(30 min.), +85+/-2℃(30 min.)
Perform this a cycle, repeat 5 cycles
EIA-364-32C, ConditionⅠ
Salt Spray鹽霧測試
Temperature Life溫度環境
Humidity Temperature Cycling溫度測試
Thermal Shock熱能
Resistance to Soldering Heat焊接溫度阻抗
Solderability焊接範圍
Mechanical Shock耐衝擊性
Vibration耐震動性
Durability耐久性
Unmating Force拔出力
Mating Force插入力
Temperature Rising溫度測試
Insulation Resistance絕緣阻抗
Dielectric withstanding Voltage耐電壓
Contact Resistance接觸阻抗
Examination of Product產品檢驗
Test Sequence（a）測試順序
Test Group 測試群組
Humidity-Temperature Cycle熱度測試
Mated Connector 25~65℃, 90~95% RH, 10 Cycles
EIA-364-31B.
15
Temperature Life
(Heat Aging)溫度環境
Mated Connector 85℃, 250 hours, EIA-364-17B.
16
No detrimental corrosion allowed in contact area and base metal exposed.
在金屬接觸面沒有不利的損害
Subject mated connectors to 35+/-2℃ and 5+/-1% salt condition for 48hours. After test, rinse the sample with water and recondition the room temperature for 1 hour. EIA-364-26B, Condition B
Figure 1（End）
NOTE：Shall meet visual requirements, show no physical damage, and meetrequirement of additional tests as specified in the test sequence in Figures 2
備註：可見的規定必須沒有物質損害，必須符合增加的測試如接續的圖表二
3.6. Product Qualification and Requalification test產品描述和規格測試
Test or Examination
測試或檢驗