The Tlam SS LLD

The Tlam^TM SS LLD foruse as a thermally conductive PCB substrate. It is a multi-purpose,thermal enhanced PCB substrate system specifically designed forheat dissipation in bright and ultra-bright LED moduleapplications. The thermally conductive PCB substrate provides 8-10times the heat dissipation as compared to conventional FR4-basedPCBs; a key ability in keeping components cool.

A copper circuit layer and aluminum or copper base platebonded together with an LLD dielectric, which is essential for highperformance PCB substrate. The dielectric can fit, and throughprocessing, standard FR4 print-and-etch operations without variousparameter modifications. These dielectrics provide electricalisolation, heat transfer, and a layer of substrate adhesion.

The enhanced Tlam SS LLD stainless steel processing throughthe standard selection and placement of surface mount technology(SMT) and manual wire bonding operation. Construction standards areset by one or 2 ounces of copper and 0.040 (1) or 0.059 (1.5)inches (mm) thick aluminum, 5052, 0.040 (1) or 0.062 (1.6) inches(mm) thick aluminum, 6061; with a copper base available.