Multicore DA100

Furthermore, packaging specialists that wish to usehigh-lead solders today, can easily move to lead-free solderstomorrow, while utilizing the same flux system offered throughMulticore® DA100™. This ability to employ a consistent flux systemis extremely beneficial to customers, as it minimizes the impact offlux reliability evaluation programs for such critical elements ascleanability, wire bonding and molding, among others.

 

Formulated for printing processes, Multicore DA101 is a fluxsystem that can not only handle reflow with high-lead alloys, butwith lead-free based alloys as well. The robust nature of the fluxformula provides customers the flexibility to alter alloys based onprocess requirements. With the various alloy ranges, DA101 canwithstand temperatures of 300°C to 330°C for high-lead reflowprofiles and tolerates lead-free temperatures between 240°C and270°C.

 

And, while Multicore DA100 and Multicore DA101 addressdifferent application needs, both products effectively replaceolder-generation power device die attach materials.

Other advantages of Multicore DA100 and Multicore DA101 aretheir wetting adaptability and void reduction capabilities. While anumber of current leadframe finishes are copper, alternativemetallizations are emerging and, therefore, wetting adaptability tocopper as well as NiPdAu and Ag finishes, among others, isessential.