“The B revision of IPC-7095 was released at APEX® inVegaswith 100 percent approval of voting members, which isanextraordinary achievement and a great tribute to the hard workofthe committee,” says Ray Prasad, principal of RayPrasadConsultancy Group and committee chair.
“This version focuses on the design and assembly issuesoflead-free BGAs along with applications that use both tin-leadandlead free on the same board, including various solder ballalloys,new laminate materials for lead free, BGA trace escape androutingconsiderations during board design to improve yield andreducecost,” adds Prasad. “There is also a detailed discussion ofreflowsolder profiling, void process indicators and ways toimproveproduct reliability.”Posted by IPC