Multicore LF730
Source by Henkel
Henkel has developed a MulticoreLF730.
With the company's Multicore DAPPlus Type 4 solder powder at its foundation and an innovative fluxmedium that allows for greater process latitude, Multicore LF730enables robust high-speed printing even for extremely fine parts,successfully printing thorough apertures as small as 160 microns indiameter and stencils as thin as 80 microns.
Multicore LF730 has many advantages:
First, Unique Approach. The new particle size distribution ofHenkel paste to provide more solder to each aperture, but moredangerous aperture blockage, compared to the traditional type 4paste. The improved packing efficiencyensures greater volume through the aperture and consistent volumerelease of over 90%.
What's more, Multicore LF730 alsoprovides assembly specialists with the manufacturing latitude theyneed to cope with often uncontrollable conditions such asvariations in PCB surface finishes.
And then, the multi-core LF730 ability to provide a goodwetting surface treatment, it is very important, because thequality changes in the PCB surface coating can often be produced tothe customer the current challenges, in particular the widespreadsolder paste wetting.
Multicore LF730 Other advantages include excellent open and abandon times with outstandingresults after two to three hours even on the smallest apertures(225 microns), standard refrigeration storage, a six-month shelflife and good hot slump resistance, printing very narrow geometrieswithout any bridging. Coalescence of the material is alsosuperb, resulting in a solder joint with a remarkably smooth, shinyfinish.