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HyperBGA

HyperBGA


Thursday, August 27, 2009 | Endicott Interconnect


Endicott InterconnectTechnologies (EI) announced improved capabilities of HyperBGA®PTFE-based "coreless" semiconductor package. Now packing more powerand density with the addition of signal layers, HyperBGA® enablessemiconductor devices to run at extremely high speeds. Thecombination of the low loss, low dielectric constant material andstrip line cross sections enable digital signal speeds surpassing12 Gb/s, delivering superior electricalperformance.

EI bare_mcm_web.jpgHyperBGA® offers the longest flip chip BGA life available and outperforms ceramic BGA packages by delivering up to 10 times the reliability. The material compliance of the PTFE material enables this major difference by eliminating the BGA wear out, die cracking, delamination or flip chip bump fatigue seen in other packages. These characteristics provide reliable performance that translates into extended life for large die and system-in-packages (SiP) for mission critical applications.

"Due to increasedcustomer interest in both single-chip and SiP offerings, wecontinue to fund the development of our HyperBGA® product line,increasing wiring density and layer count for both digital and RFdesigns. We are also replacing the outer dielectric with adomestically produced material, which further strengthens EI'sability to provide total packaging solutions," stated Rajinder Rai,Vice President of EI's Microelectronics Division.

HyperBGA® isassembled using standard SMT processes and materials, makingcolumns or land grid array sockets unnecessary. It is capable offlip chip, SMT or CSP component attach on both sides. Functionalmodule testing is now available and HyperBGA® is lead-free assemblycompatible.

The HyperBGA®product line is an excellent solution for networking, high endserver, telecommunications, aerospace, military and medicalapplications where speed, reliability and increased signal I/O,along with reduced size, weight and power (SWaP) are critical. Thislow stress flip chip laminate package is also ideally suited formulti-layer, RF, chipon- flex or any application requiring a SiPapproach.