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Rohm and Haas to Introduce New Materials

Rohm and Haas to Introduce New Materials

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SourcePCB007  
Rohm and Haas is introducing twoinnovative digital imaging processes for innerlayer and UV maskfabrication. The LithoJet™ 210 Etch Resist and LithoJet™ UV Maskinks, coupled with the latest inkjet technology from our equipmentpartners, can measurably help manufacturers improve yields,simplify process steps and reduce costs.
In response to customers' needs formore reliable, flexible and cost effective electroplatingsolutions, Rohm and Haas is introducing three acid copper platingproducts. Copper Gleam™ CF 25 acid copper is designed for pattern,panel and button plate viafilling. Copper Gleam™ CuPulse™ Plus acidcopper delivers the best performance in pulse plating technology.And Copper Gleam™ HT-55 acid copper, our latest in high-performanceDC electrolytic copper processes.
The company's next generation finalfinish process is catered to the ever evolving assembly andreliability requirements. The combination of Duraposit™ SMT-88electroless nickel and Aurolectroless™ SMT-88 immersion goldprovides a proven process with superior stability that is lessprone to skip plating and nickel corrosion.
Several new Laminar™ dry filmproducts for innerlayer photo resist (Laminar™ E8000 series andE9012), multi-functional Alkali etch (Laminar™ E9200), and laserdirect imaging (Laminar™ UD700) will also beexhibited.
Aurolectroless, Circuposit, CopperGleam, CuPulse, Duraposit, Laminar, Pallamerse, LithoJet, Rohm andHaas and Rohm and Haas Electronic Materials are trademarks of Rohmand Haas Company or its affiliates.

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