Revision B of IPC-7095 Design and Assembly Implementation for BGAs
Association Connecting Electronics Industries® hasannouncedthe release of IPC-7095B, Design and AssemblyProcessImplementation for BGAs. Implementing ball grid array(BGA)and fine-pitch ball grid array (FBGA) technology presentsuniquechallenges for design, assembly, inspection and repairpersonnel,especially in light of recent changes in alloys andsurfacefinishes. IPC-7095B offers practical information toanyonecurrently using BGAs or considering a conversion to areaarraypackaging formats. “The B revision of IPC-7095 was released at APEX® inVegaswith 100 percent approval of voting members, which isanextraordinary achievement and a great tribute to the hard workofthe committee,” says Ray Prasad, principal of RayPrasadConsultancy Group and committee chair.
“This version focuses on the design and assembly issuesoflead-free BGAs along with applications that use both tin-leadandlead free on the same board, including various solder ballalloys,new laminate materials for lead free, BGA trace escape androutingconsiderations during board design to improve yield andreducecost,” adds Prasad. “There is also a detailed discussion ofreflowsolder profiling, void process indicators and ways toimproveproduct reliability.”
Posted by IPC