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Wire Bonding Technology

Development of a coated Wire Bonding Technology




A coated wire bonding technique is proposedwhereunnecessarycoatingfilm is removed by arc heat synchronouslywithballformation afterwhich the wire is bonded with thechip(firstbonding). The wire isthen bonded on a lead while thecoatingfilmis removed by ultrasonicenergy and excess heat(secondhandling).Highly heat-resistantpolyurethane is theoptimummaterial forsatisfying the requirementsof no carbonizationby heatduring ballformation and no heatdeterioration. Thegas-blowingmethod forball formation is effectivein preventing thecapillaryfrombecoming contaminated or clogged.Short-time dischargeiseffectivein reducing the amount of meltedcoating filmimmediatelyabove aball. An average voltage resistanceof insulationof 850 Vand athickness of about 1.0 μm are sufficientfor thecoating filmtoobtain satisfactory bondability andgoodreliability.Thisinsulation coating film (applied to Auwiresurfaces)preventsshort circuits, even if wires touch.Thistechnologyfacilitatesthe manufacture of multipinASIC(application-specificIC)devices






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