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COF(Chip On Flex,or Chip On Film, or flip chip film)
Fix the IC on the flexible circuit board grain soft film technology, which using soft additional circuit boards as packaging chip carrier, put the chip and soft circuit board joint together.
COG(Chip on glass)
The chip is binding on the glass directly .This approach can greatly reduce the volume of the entire LCD module, and easy for mass production, apply for consumer electronic products, such as mobile phone, PDA, etc.
DIP(dual in-line package)
Dual in-line package, one of the Cartridge type packaging, the pins lead to both sides of packaging, there are two kinds of packaging materials, plastic and ceramic. DIP is the most popular Cartridge type packaging, applications include standard logic IC, memory LSI, microcomputer circuit, etc. Pin center distance of 2.54 mm, pin number from 6 to 64. Packaging width usually is 15.2 mm. Some are 7.52 mm and 10.16 mm respectively called skinny DIP and slim DIP (narrow size DIP). But in most cases is not distinction, simply referred to as DIP. In addition, with low melting point glass sealed ceramic DIP also called cerdip.
PDIP
P-Plasti, is the mark for plastic packaging. e.g. PDIP represents plastic DIP.
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SDIP (shrink dual in-line package)
Shrink type DIP, one of cartridge type packaging, same shape as DIP, but the pin center distance (1.778 mm) is less than the DIP (2.54 mm), so name it. Pin number from 14 to 90. Also called SH-DIP. There are two kinds of materials, ceramic and plastic.
SKDIP/SKY(Skinny Dual In-line Packages)
One of the DIPs. With width of 7.62 mm, pin center distance of 2.54 mm, narrow size DIP, often also called DIP (refer to DIP).
DIP-tab
One of the DIPs.
CDIP
C-ceramic, ceramic packing mark. For example, CDIP represents ceramic DIP. In practice, which is often used.
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DICP(dual tape carrier package)
Dual pin tape carrier packaging. One of the TCP (with carrier packaging). Pin production lead from the insulated tape on both sides of the packaging. Due to the use of TAB (with automatic welding) technology, packaging shape is very thin. Often used for liquid crystal display driver LSI, but most are customized. In addition, 0.5 mm thin shape memory LSI packaging is under development. In Japan, according to the EIAJ(Japan electronic machinery industry) standards, named DICP as DTP.
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DIC(dual in-line ceramic package)
Nickname of the ceramic DIP (including glass seal).
SIP(single in-line package)
Single in-line package. Pin from one side of the packaging, arranged in a straight line. When assemble to the print board, it is mounting on side. Pin center distance of 2.54 mm usually, pin number from 2 to 23, most for customized products. With a variety of shapes. Some with same shape of ZIP named SIP.
SOP(Small Outline Packages)
Small pin Outline Packages.
SSOP(Shrink Small-Outline Package)
Shrink Small-Outline Package, philips has developed the small outline package (SOP) from 1968 to 1969.
TSOP(Thin Small Outline Package)
Thin Small Size Package.TSOP memory is pins around the chip, adopt SMT (surface mount technology) directly attached on the surface of PCB.
TSSOP(Thin Shrink Small Outline Package)
Thin shrink SOP. Thinner than SOP, pin more dense, much smaller packaging with same function.
HSOP(HeaT Sink Small Outline Packages)
H- (with heat sink), is the mark for SOP with the radiator. For example, HSOP means SOP with radiator.
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DFP(dual flat package)
Dual pin flat package. Nickname of SOP (see SOP). It used to name it, but not now, 10, DIC (dual - line in ceramic package) is the nickname of ceramic DIP (including glass seal) (see DIP).
DSO(dual small out-lint)
Dual pin small outline package. Nickname of SOP (see SOP). Some semiconductor manufacturer use this name.
MFP(mini flat package)
Small flat packaging. Nnickname of plastic SOP or SSOP (see the SOP and SSOP). Some semiconductor manufacturers use this name.
SO(small out-line)
Nickname of SOP. A lot of semiconductor manufacturers in the world use this nickname. (see the SOP).
SOIC(small out-line integrated circuit)
Nickname of SOP (see the SOP). Many semiconductor manufacturers use this name aboard.
SOJ(Small Out-Line J-Leaded Package)
J shaped pin small packaging. One of the SMT type packaging. Pin from both sides of packaging downwards a J shape, so named it. Usually in the form of plastic products, mostly used in DRAM and SRAM of the memory LSI circuit, but most of it is DRAM. Packaged with SOJ DRAM devices mostly are assembled on the SIMM. Pin center distance of 1.27 mm, pin number from 20 to 40 (see SIMM).
SOT（Small Outline Transistor）
Small appearance transistor, a SOP series packaging.
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TO（Transistor Outline）
Transistor Outline Packaging.
QFP(quad flat package)
Four side pin flat package. One of SMT type packaging, pins from the four sides assumes the gull wing type (L). Base material is ceramic, metal and plastic. See from the quantity, the plastic packaging accounts for most of them. When there is no special show material, most is plastic QFP. The most popular of Plastic QFP is multi-pin LSI package. Not only for microprocessors, door display of digital logic LSI circuit, but also used in VTR + signal processing, audio signal processing analog LSI circuit. Pin center distance is 1.0 mm, 0.8 mm and 0.65 mm, 0.5 mm and 0.4 mm, 0.3 mm and various specifications. Center distance of 0.65 mm specification in most pin number is 304. The pin center distance is less than 0.65 mm of QFP, Japan called it QFP (FP). But now the Japanese electronic machinery industry reevaluate the appearance of QFP specifications. On the pin center distance without distinction, but according to package thickness of the QFP (2.0 mm to 3.6 mm thick), LQFP (1.4 mm thick) and TQFP (1.0 mm thick) three types. In addition, some LSI manufacturer named the pin center distance of 0.5 mm of QFP specifically as deflating QFP or SQFP, VQFP. But some manufacturer named pin center distance of 0.65 mm and 0.4 mm of QFP also as SQFP, to make the name slightly some confusion. QFP weakness is that when the pin center distance is less than 0.65 mm, pin bend easily. In order to prevent deformation of pin, there are several improved QFP varieties. Such as packages; such as four corners with cushion the tree BQFP (see BQFP); With resin protection ring covering the front of the pin GQFP (see GQFP); Setup test bumps in the package, TPQFP which can test in special fixture to prevent deformation of pin(see TPQFP). In terms of LSI logic, a lot of development products and high reliable quality products are packaged in the multi-layer ceramic QFP. Minimum pin center distance is 0.4 mm, pin count up to 348 products has come out. In addition, also use glass sealed ceramic QFP (see Gerqa ).
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LQFP(low profile quad flat package)
Thin type QFP. Refers to QFP package thickness of 1.4 mm, Japan electronic machinery industry use this name according to the new QFP specifications.
MQFP(metric quad flat package)
A classification which is according to JEDEC (united electronics commission) standard of QFP. Pin center distance of 0.65 mm, thickness from 3.8 mm to 2.0 mm standard QFP (see QFP).
TQFP（Thin Quad FLat Packages）
Thin Quad FLat Packages
SQFP（Shorten Quad FLat Packages）
Shorten pin Quad FLat Packages QFP.
BQFP(quad flat package with bumper)
With the four side of the pin cushion flat package. One of QFP package, set in the four corners of the package protrusions (cushion) in order to prevent the bending deformation of pin occurred in the process of transportation.The American semiconductor manufacturer mainly in microprocessor and ASIC circuit adopts this package. Pin center distance of 0.635 mm, pin number from 84 to 196.
PQFP(PlasticQuadFlatPackage)
Plastic quad flat package.
FQFP(fine pitch quad flat package)
Small pin center distance QFP. Usually refers to pin center distance is less than 0.65 mm of QFP (see QFP). Some conductor manufacturers use this name.
PFPF(plastic flat package)
Plastic flat pack.Plastic QFP nickname (see QFP). Some LSI manufacturer use this name of the part.
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QFN(quad flat non-leaded package)
Four side without pin flat packge. One of the SMT type packaging. Now known as the LCC. QFN is named by the Japanese electronic machinery industry. Packaging configuration has four side electrode contact, because without pin, SMT occupied area is smaller than QFP, height is lower than QFP. However, when the printing base stress with package, the electrode contact cannot be alleviated. So electrode contact is difficult to make the pins of QFP, generally from 14 to 100. There are two kinds of materials, ceramic and plastic. Where there is marked LCC, it is ceramics QFN. Electrode contact center distance of 1.27 mm. Plastic QFN is printing base glass epoxy resin base material of a low-cost package. Electrode contact center distance, besides 1.27 mm, there are 0.65 mm and 0.5 mm. The packaging is also known as plastic LCC, PCLC, P-LCC, etc.
LCC(Leadless chip carrier)
No pin chip carrier. Refers to the four sides of the ceramic base electrode contact without pin but SMT type packaging.
Is high speed and high frequency IC packaging, also known as ceramic QFN or QFN - C (see QFN).
PLCC(plastic leaded chip carrier)
Plastic leaded chip carrier. One of the SMT type packaging. Pin from the four sides of package, a crowd, is plastic products. Texas instruments companies in the United States in the first place in the 64 and 256 k bit DRAM k dram using, is now popular used in logic LSI, DLD clutches (or logic devices) circuit, etc. Pin center distance of 1.27 mm, pin number from 18 to 84. J shaped pin is not easy to deformation, easier to operate than QFP, but after welding inspection is difficult. PLCC with LCC (also called QFN) is similar. Previously, the difference between the two is that the former only in plastic, the latter with ceramic. But now there have been fabricated with ceramic J shaped pin and no pins made of plastic packaging (marked as plastic LCC, PC LP, P - LCC, etc.), has been unable to distinguish. The Japanese electronic machinery industry decide in 1988, from the four side raises encapsulation of J shaped pin called QFJ, encapsulate in four side with electrode bumps called QFN (see QFJ and QFN).
CLCC(ceramic leaded chip carrier)
With pin ceramic chip carrier, one of SMT type packaging, the pins from the four sides of package, a crowd. With a window is used to package ultraviolet erasing an EPROM and microcomputer with EPROM circuit etc. The packaging is also known as QFJ, QFJ-G.
JLCC(J-leaded chip carrier)
J shaped pin chip carrier. Refers to the nickname of window with CLCC and ceramic QFJ with window (see CLCC and QFJ). Some semiconductor manufacturers use this name .
LGA(land grid array)
Contact display packaging. Array at the bottom the electrode contact packaging. Plug the socket when assembly. There are 227 contact (center distance 1.27 mm) and 447 contact (center distance 2.54 mm) LGA ceramic, applied to high-speed LSI logic circuit. Compared with QFP, LGA accommodates with smaller package more input/output pin. In addition, because of the small lead impedance, is very suitable for high speed LSI. But because the socket production complex, high cost, now seldom use. It is expected that the demand will increase in the future.
PGA(pin grid array)
Display pin package. One of the cartridge type packaging, the vertical pin at the bottom is displayed. The base material basically use multi-layer ceramic base. Under the condition of not specifically show the names of materials, mostly it is ceramic PGA, used for high speed large scale logic LSI circuit. The high cost. Pin center distance of 2.54 mm, usually around the pin number from 64 to 64. In order to reduce costs, packaging printing base use glass epoxy resin base material instead. There are 64 ~ 256 plastic PG A pin. In addition, there is a pin center distance of 1.27 mm short pin type surface-mount PGA (touch welding PGA).(see surface-mount PGA).
CPGA(Ceramic Pin Grid Array)
Ceramic pin grid array packaging.
BGA(ball grid array)
The spherical contact display, one of the SMT type package. At the back of the printed base display mode to produce spherical convex point to replace pin, in the front of the printed base assembly LSI chips, then by moulding resin or potting method for sealing. Also known as the convex point display carrier (PAC). Pin can be more than 200, one of the multi- pin LSI package. Package body also can do better than QFP (four side pin flat pack). For example, pin center distance of 1.5 mm 360 pin BGA is only 31 mm square; And pin center distance of 0.5 mm 304 pin QFP is 40 mm square. And BGA don't have to worry about QFP pin deformation problem.
The package was developed by Motorola companies in the United States, first of all be used in devices such as portable phone, it is likely to spread in the personal computer in the United States in the future. Initially, BGA pin (convex point) of the center distance of 1.5 mm, pin number is 225. Now there are some manufacturer of LSI is developing 500 pin BGA. BGA problem after reflow soldering appearance inspection. It is unclear whether the appearance of the effective inspection method. Some think that due to large welding of center distance, connection can be regarded as a stable, only through a function to deal with. Motorola companies in the United States call with sealed moulded resin encapsulation OMPAC, and called the potting method sealed packaging GPAC (see OMPAC and GPAC).
FBGA（Fine-Pitch Ball Grid Array）
Fine pitch ball grid array.
PBGA（Plastic Ball Grid Array）
Plastic welding ball grid array.
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FCBGA（Flip Chip Ball Grid Array）
Flip chip ball grid array.
CBGA
C - ceramic, ceramic packaging mark. Ceramic welding ball grid array.
MCM(multi-chip module)
Multi-chip module. A packaging which put several blocks of semiconductor bare chips assembly on a wiring board. According to the substrate material can be divided into MCM -l, MCM - C and MCM -d three categories. MCM-L is used usually multi-layer printed base glass epoxy resin components. Wiring density is not very high, the cost is low. MCM-C is the formation of multi-layer wiring, with thick film technology in ceramic (alumina ceramic or glass) as the base plate component, and the use of multilayer ceramic substrate thick film hybrid IC similar. There was no significant difference. Wiring density higher than that of MCM-L.
MCM-d is form multi-layer wiring with membrane technology, ceramic (alumina and aluminum nitride) or Si, Al component as the base plate. Wiring plot is the highest in the three components, but the cost is high.
OPMAC(over molded pad array carrier)
Molding resin sealing convex point display carrier. American Motorola company named the molding resin sealing BGA (see BGA).
CPAC(globe top pad array carrier)
Motorola companies in the United States use the nickname of BGA (see BGA).
LOC(lead on chip)
Lead packaging on the chip. One of LSI packaging technology, in the front of the lead frame is a structure above the chip, there is convex solder joints near the center of chip, sewn up with lead to electrical connections. Compared to the original use the lead frame as a structure near the sides of the chip, same size packaging of the chip up to around 1 mm in width.
COB(chip on board)
Board chip packaging, is one of the bare chip SMT technology, semiconductor chips handover pasted on the printed circuit boards, lead the electrical connection in the chip and the base board with suture method, use resin covered in order to ensure reliability. Although the COB is the simplest bare chip SMT technology, the packaging density is much less than the TAB and slice welding technology.
PCLP(printed circuit board leadless package)
Printed circuit board leadless packaging. Japan Fujitsu use the name of plastic QFN (plastic LCC) (see QFN). There are two specifications, pin center distance is 0.55 mm and 0.4 mm. Is currently under development.
SIMM(single in-line memory module)
Single in-line memory module. Equipped with electrode storage module only at one side of the printed circuit board. Usually refers to insert the socket of the module. There are two standard SIMM specifications, i.e. the center distance of 2.54 mm 30 electrodes and the center distance of 1.27 mm 72 electrode. Single-side or double-side printing board are equipped with 1 million SOJ packaging and 4 million-bit DRAM SIMM, have common used in personal computers, workstations and other equipment . At least 30 to 40% of the DRAM assembly in SIMM.
SMD(surface mount devices)
Surface-mount devices. Occasionally, some semiconductor manufacturer mistake the SOP for SMD (see the SOP).
QFJ(quad flat J-leaded package)
Four sides J shaped pin flat packaging. One of the SMT packaging. Pin leads to four sides, down J glyph. In the name of the Japanese electronics machinery industry rule. Pin center distance of 1.27 mm. Two kinds of materials, plastic and ceramic.Plastic QFJ most often referred to as the PLCC (see PLCC), used in microcomputer, door display, DRAM, ASSP, OTP circuit, etc. Pin number from 18 to 84. Ceramic QFJ also called CLCC, JLCC (see CLCC). Encapsulation type used for ultraviolet erasing type EPROM with windows and microcomputer chip circuit with EPROM. Pin number from 32 to 84.