|We offer competitive price & reliable assembly services for : |
Process Capability :
- Surface Mount Components
- Leaded Type components
- COB Die Bonding
- Housing Assembly
- Smallest SMD component : 0201
- Clean Room Standard : 10000
- BGA, Micro BGA, QFP...
- Lead-Free Soldering Equipment and Experience
We have outstandingexperience in the followingfields:
VCD playersfor Asian market
We manufacture the mpeg board and the CD control board for ourHong Kong base customer.
Home breadmaker for world wide market including Japan, Europe &US
We manufacture the control board and the display board for ourJapanese customer.
We have manufactured a lot of different kinds of peripherals,Mainly for US customers.
Digital voicememo diary
We have manufactured a few models for different customer, somefully assembled, some PCBA level, some bonding only.
Japanese pocket games; guns, driving wheels, memory cards and alot others for TV games. Some full assembled, some PCBA, somebonding only.
Energy savinglight bulb
We worked on this product with a Japanese customer - Wako Denki,which is a subsidiary of Toshiba Lighting.
Digitaltimers, Thermometers, Power meters, Gifts andToys
For various customers in various forms : complete assembled andpacked, PCBAs, COBs.
| Electronicscorporations and procurement offices nowadays are increasinglytaking the advantage of off-shores Electronics ManufacturerServices providers to streamline their productionprocesses. We are a dynamic, qualityoriented and well-connected OEM Manufacturer who is playing animportant role in the Far East region.|
|l COB Die Bonding|
|l Surface Mount componentsassembly|
|l Leaded-type components assembly and Lead-free type componentsassembly|
|l Box-build assembly|
|l Technicalexpertise and sophisticated production facilities|
|Material Turn-Key Process|
|1 . Output : 4,230 K chips / day (125 million chips per month)|
|2 . Record of produce report|
| a . SMT machine canassemble BGA & μBGA|
| b .SMT machine can assemble smallest chips of1005(0402mm) size.|
| c .IC pitch is 0.3mm|
| d .Largest size PCBA is 350mm x 400mm|
|1 . Bonding Wireoutput: 2,000K wires / day (60 million wires permonth)|
|2 . Using aluminiumwire ψ0.8 mil toψ1.25 mil|
|3 . IC PAD smallestarea is 63*80μ㎡|
|4 . COB can traverseall reliability test|